Custom and Hybrid Assemblies

Cirtek’s Custom and Hybrid Assemblies is the advanced technology of placing multiple ICs, passive components, opto couplers and crystal oscillators into a  single package.  Cirtek hybrid assemblies in production are Multichip Diode Array, Plastic Molded Oscillator/Half-Full Duplex Communication Modules and Opto relay solid-state switches.

Multichip Dioded Array line produces various configurations of multiple diodes mounted on a silver spot plated copper substrate.  The final product comes out in different options like a dual-in-line or a single-in-line through hole board insertions or a small outline surface mounted package.

Plastic Molded Oscillators/Half – Full Duplex Communication Modules components mounted onto the circuit include IC chip, capacitors and crystal in sealed form supplies ready for mounting.  The mounting is done automatically with the sequence defined such that there is no disturbance to mounted components.

Opto Relay Solid State switches are assembled using LED and control IC(photovoltaic generators). The IC is coupled to LED by dome coating using a clear, transparent silicone material with corresponding shape, height and pattern.