Aerospace, Telecom, Military & High Reliability

Cirtek  Aerospace, Telecom, Military & High Reliability products are packaged in ceramic substrate, TO (Transistor Outline) metal can headers, ceramic leadless chip carrier, ceramic flatpack and custom ceramic package consigned by customer. Cirtek devices in production are Hybrid Oscillator Circuit, Amplifier Circuits, Microwave and RF Modules and Opto Relay / Chip Switch Assembly.

Cirtek Hybrid Oscillator Circut final product appears as either rectangular or a square cavity module on a can-capped gold header. Ceramic substrate module contain semiconductor chips, transistors and diodes, capacitors, and inductors. The addition of a crystal blank into this combination of active and passive electronic components completes the oscillator circuit. Hermeticity is guaranteed to meet Mil Std 883 leak rates. Finished products undergo 100% parametric testing and visual inspection prior to shipment.

Amplifier Circuits hybrid assembly is dependent largely on an active device  emanating from a GaAs thin wafer technology. This chip combines with one or two chip capacitors in a Silicon MOS technology to complete a low-noise, high power amplifier circuit. The final product is a hermetically sealed package for surface mount applications. Parts undergo 100% DC parametric testing, and then shipped on tape and reel.

Microwave and RF Modules are assembled in multiple sets; each set could be similar with the other set. A ceramic substrate and FR-4 PCB are used. Diode Capping for cavity-type use lid with B-stage epoxy. Parts are top branded and shipped on tape and reel.

Package Drawing

Bomb Shell