Failure Analysis and Reliability (FARel)

We provide all the reliability testing capabilities and product analysis capabilities required to address the complex issues that may arise from package, material, and device interactions.

Our Objectives:

• Find the root cause of a component, material, and/or process defects which may include corrective action recommendations to material suppliers
• Analyze electronic components especially semiconductor devices and help solve problems involving process development and engineering
• Assess the reliability risks associated with new package designs using reliability methodologies
• Communicate the results to customers
• Develop immediate corrective actions on any reliability-related issues identified through the analyses