Die Sales

Conducted in a Class 10K clean room environment using state-of-the-art equipment

This service includes backgrind, die pp, inspection, as well as pick-and-place into trays. Die inspection capabilities include commercial and military standards criteria. Special processing and shipping services are available upon request.

ATEC Die Sales Advantage

• Provides an efficient solution to supply-inspected die for use in chip-on-board applications
• Avoids the need for the chip supplier to invest in the manufacturing infrastructure for handling and packaging bare die
• ATEC Die Sales may be packaged with test services

Details of Services

• Class 10K Clean Room Environment
• Up to 8″ Wafer Diameter
• Backgrinding to 6 mils (0.15mm) thin minimum
• Die Inspection Standards
• Die to Chip Tray or to Waffle Pack or to new Wafer Tape