Customized Packaging
Product Details
| Type | Leadframe Based, Ceramic Based, PCB Based |
|---|
Supplier Info
Automated Technology (Phil.) Inc.
Light Industry and Science Park, Hologram Street, Cabuyao City, Laguna, 4025
Product Description
Leadframe-based
Commonly used is Plastic Dual In-line Package, but any other outline can be used. It can have ICs, LED, Resistors, Diodes, Capacitors, and both Active and Passive components.
Ceramic-based
ICs and components directly mounted onto ceramic of PCB substrate. Current products being assembled in ATEC contain 2 to more than 100 chips on board.
PCB-based
Printed Circuit Board is used as substrate. Parts can be mounted on either or both sides of the PCB.
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