BELL Electronics Corporation was established as an assembly and test subcontracting house for optoelectronics and sensor devices. Initially, we focus our resources in metal can packaging. The second phase of the company’s programs will be towards the development of other types of optoelectronics and sensors device packaging (molded plastic packages and other advance packaging).

Bell Electronics is geared towards assembly process and materials development in support of our customer’s effort in product development. We also focus in equipment automation and upgrade to support customers’ needs for volume production at highly competitive assembly pricing.